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Use of diffracted light from latent images to improve lithography control

机译:使用衍生图像的衍射光来改善光刻控制

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As the microelectronics industry strives to achieve smaller device design geometries, control of linewidth, or critical dimension (CD), becomes increasingly important. Currently, CD uniformity is controlled by exposing large numbers of samples for a fixed exposure time which is determined in advance by calibration techniques. This type of control does not accommodate variations in optical properties of the wafers that may occur during manufacturing. In this work, a relationship is demonstrated between the intensity of light diffracted from a latent image consisting of a periodic pattern in the undeveloped photoresist and the amount of energy absorbed by the resist material (the exposure dose). This relationship is used to simulate exposure dose control of photoresist on surfaces which have different optical properties chosen to represent surfaces typical of those found in operating process lines. Samples include a variety of photoresist materials and substrates with a wide variety of optical properties. The optical properties of the substrates were deliberately varied to determine the effect of these properties on CD (in the presence and absence of an exposure monitor) during lithography. It was observed that linewidth uniformity of the developed photoresist can be greatly improved when the intensity of diffracted light from the latent image is used to control the exposure dose. Diffraction from the latent image grating structures was modeled using rigorous coupled wave analysis. The modeling is used to predict the diffraction from a latent image as a function of the substrate optical properties and the parameters of the latent image (i.e., linewidth, sidewall angle). Good agreement is obtained between theoretical and experimental observations. Conversely, the inverse problem is solved in which the parameters of the diffracting structure (the latent image) are determined from a measurement of the diffracted power. Therefore, the diffracted power can be monitored for the purpose of determining when the latent image will produce the proper CD upon development.
机译:随着微电子工业努力实现较小的设备设计几何形状,对线宽或关键尺寸(CD)的控制变得越来越重要。目前,通过暴露大量样本来控制用于通过校准技术预先确定的固定曝光时间的大量样品来控制CD均匀性。这种类型的控制不会适应在制造期间可能发生的晶片的光学性质的变化。在这项工作中,在从未开发的光致抗蚀剂中的周期性图案组成的潜像和由抗蚀剂材料(曝光剂量)吸收的能量的潜像之间的光强度之间证明了关系。这种关系用于模拟表面上的光致抗蚀剂的曝光剂量控制,该表面具有选择的不同光学性质,以表示在操作过程线中发现的那些所示的典型的表面。样品包括各种光致抗蚀剂材料和具有多种光学性质的基材。底物的光学性质被刻意变化以在光刻期间确定这些性质对Cd(在存在和不存在暴露监测器的情况下的影响)。观察到,当来自潜在图像的衍射光的强度用于控制曝光剂量时,可以大大提高发育光致抗蚀剂的线宽均匀性。利用严格的耦合波分析建模来自潜像光栅结构的衍射。建模用于将潜像的衍射作为基板光学性质的函数和潜像(即,线宽,侧壁角度)的函数。在理论和实验观察之间获得了良好的一致性。相反,解决了逆问题,其中从衍射功率的测量确定衍射结构(潜像)的参数。因此,可以监视衍射功率,以确定何时潜在图像在开发时产生适当的CD。

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