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Comprehensive modeling and evaluation of Network-on-Chip performability

机译:综合建模与芯片交换性能的综合建模与评估

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摘要

The rapidly increasing transistor density enables the evolution of many-core on-chip systems. Networks-on-Chips (NoCs) are the preferred communication infrastructure for such systems. Besides, NoCs have also been proposed to solve the complex on-chip communication in the three-dimensional systems-on-chips (3D SoCs). A downside of technology scaling is the increased susceptibility to failures in NoC resources. It is challenging to analyze the performance and reliability of degradable NoCs. In this paper, we propose a generic framework to evaluate the performability of both 2D and 3D NoCs under consideration of different fault models. Moreover, we use a partially-connected 3D Mesh and hexagonal NoCs to demonstrate our framework. Transient performabilities of the 3D fault-tolerant negative-first (3D-FTNF) and elevator-first routing algorithms are evaluated. Finally, we compare the transient performabilities of a hexagonal NoC and a mesh NoC.
机译:快速增加的晶体管密度能够实现许多核心片上系统的演变。网络上的网络(NOCS)是此类系统的首选通信基础设施。此外,还提出了NOC,以解决三维系统上的复杂的片上通信(3D SOC)。技术缩放的缺点是对NOC资源中失败的易感性增加。分析可降解NOCs的性能和可靠性是挑战性的。在本文中,我们提出了一种通用框架,以评估2D和3D NOCS在考虑不同故障模型的情况下的可操作性。此外,我们使用部分连接的3D网格和六边形NOC来展示我们的框架。评估3D容错负第一(3D-FTNF)和电梯 - 第一路由算法的瞬态性能。最后,我们比较六边形NOC的瞬态性能和网状物。

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