As the functionality of power module package increases, the number of components in the module packages also increases. The design and molding of such large package becomes more challenging. At Fairchild Korea, Moldflow simulation aids in saving time and money during the development stage. Fairchild needs venting analysis in order to get more reliable result in the packages. The venting analysis is to calculate the pressure drop of the air (or other gases) that passes through the vent and include the effects of air pressure on the flow during microchip encapsulation process. The accurate analysis of venting is important for realistic prediction of voids that may occur during chip encapsulation. The void is causing many problems in the package. In this study, some results of venting analysis will be shown. The simulation results will be compared with experimental data.
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