Strong crescent bond and strong tail bond are crucial for maintaining reliability and bondability of the wire bond and stability of the bonding process, respectively. This study investigates the optimization of tail breaking force and pull force of the crescent bond with insulated X-Wire. The pull force and the tail breaking force are individually optimized by an iteration method. The results are compared with the results of bare Au wire. Ultrasonic power which is a measure of ultrasonic amplitude, combined with a cleaning stage during bonding plays a significant role in initiating the removal of the insulated layer of X-Wire during the crescent bonding process. The pull force and the tail breaking force of insulated X-Wire are 91.4 ± 11.78 mN and 59.15 ± 5.35 mN, comparable to those of bare Au wire.
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