首页> 外文会议>Electronics Packaging Technology Conference >Multi-layer Lamination of Embedded Channels in Low Shrinkage Ceramics based Platform
【24h】

Multi-layer Lamination of Embedded Channels in Low Shrinkage Ceramics based Platform

机译:基于低收缩陶瓷平台的嵌入式通道的多层层压

获取原文

摘要

Multi-layer lamination with carbon fugitive material to realize embedded channels in low shrinkage LTCC laminates was investigated. The sagging behaviors of suspended LTCC laminates over the cavity after lamination and co-firing were studied. Suspended LTCC laminates over the channels of width 1 to 10 mm were dimensionally stable after sintering with maximum deflection of less than 20 μm. Swelling (i.e. deflection in the opposite direction of sagging) was observed for suspended LTCC laminates over the channels of width 15 to 30 mm after co-firing. The LTCC material and carbon burnout behavior were characterized using thermal analysis techniques. Based on the thermal analyses, a multi-step burnout process was proposed to control the carbon burnout in realizing dimensionally stable embedded channels.
机译:研究了利用碳逸出材料来实现低收缩率LTCC层压板的多层层压。研究了层压后悬浮LTCC层压性的悬浮LTCC层压性和共射。在烧结后的宽度1至10mm的通道上的悬浮LTCC层叠在烧结后尺寸稳定,最大偏转小于20μm。在共触发后,在宽度为15至30mm的通道上,观察到膨胀(即,下垂的相反方向的偏转)。使用热分析技术表征LTCC材料和碳燃烧行为。基于热分析,提出了一种多步燃尽过程来控制实现尺寸稳定的嵌入式通道的碳燃料。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号