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Aluminium Induced Vapor Phase Stain Etch Method for Generating Porous Silicon Structure

机译:用于产生多孔硅结构的铝诱导的气相污染方法

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This work ensemble the structural features of Porous Silicon (PS) layers which are being fabricated employing modified stain etch method. Additionally, this study also categorizes the optimal etching parameters which are extensively used to grow Porous Silicon (PS) layers enabling Metal Induced Vapor Phase Stain Etching methodology. Various growth conditions are considered to fabricate uniform porous structures. The structural morphology of PS layers has been studied in scanning electron microscopy (SEM) that reveals macroporous nature of pore morphology supported by investigation of optical properties. This has been supported by characterizing ultraviolet-visible (UV-VIS) spectrophotometer absorption spectra. Surface and optical investigations discover uniform porous structure which augments the size of silicon substrate. This augmented surface of planar silicon substrate can be used as sensing platform for different kinds of sensors.
机译:这项工作集合了多孔硅(PS)层的结构特征,该层正在采用改进的污渍蚀刻方法制造。另外,该研究还分类了广泛用于生长多孔硅(PS)层的最佳蚀刻参数,从而实现金属诱导的气相污染蚀刻方法。认为各种生长条件是制造均匀的多孔结构。已经研究了PS层的结构形态,用于扫描电子显微镜(SEM),揭示通过研究光学性质的孔形态的大孔性质。这是通过表征紫外线可见(UV-VIS)分光光度计吸收光谱来支持的。表面和光学研究发现均匀的多孔结构,增强硅衬底的尺寸。平面硅衬底的这种增强表面可用作不同种类的传感器的传感平台。

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