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Chip defect detection based on deep learning method

机译:基于深度学习方法的芯片缺陷检测

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摘要

With the rapid development of deep learning theory and computing resources, defect detection based on deep learning has been increasingly used. Compared with traditional machine learning methods, detection methods based on deep learning can achieve end-to-end detection methods, with high flexibility and accuracy, strong network expression capabilities, and no manual design features. This paper focuses on the use of deep learning-based methods to detect chip defects: make data sets according to the types of chip defects, detect chip defect based on the YOLOv3 network and fine-tuning it. The final mAP reached 86.36%.
机译:随着深度学习理论和计算资源的快速发展,越来越多地使用基于深度学习的缺陷检测。与传统机器学习方法相比,基于深度学习的检测方法可以实现端到端检测方法,具有高灵活性和精度,强大的网络表达能力,无手动设计功能。本文侧重于利用基于深度学习的方法来检测芯片缺陷:使数据集根据芯片缺陷的类型,基于YOLOV3网络检测芯片缺陷和微调。最终地图达到86.36%。

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