首页> 外文会议>Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP >Multi-layer fringe-field augmentations for the efficient modeling of package power planes
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Multi-layer fringe-field augmentations for the efficient modeling of package power planes

机译:多层边缘场增强,可对封装电源平面进行有效建模

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Modern mixed signal system-on-package integration schemes employ power distribution networks with highly irregular geometries. To model this problem, most techniques resort to approximations which lead to the fringe fields being ignored. In this paper, an efficient modeling method is proposed for multi-layered package power/ground planes with apertures. The solution technique employs the multi-layer finite difference method (M-FDM), with fringe field corrections provided by a 2D electrostatic solver. This scheme allows for efficient frequency domain simulation, and the S-parameters obtained from the method have been compared with full-wave simulations and measurements.
机译:现代的混合信号系统级封装集成方案采用具有高度不规则几何形状的配电网络。为了对此问题建模,大多数技术都采用近似方法,导致边缘场被忽略。本文针对带孔的多层封装电源/地平面提出了一种有效的建模方法。该解决方案技术采用多层有限差分法(M-FDM),并具有由2D静电求解器提供的边缘场校正。该方案可以进行有效的频域仿真,并且已将通过该方法获得的S参数与全波仿真和测量进行了比较。

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