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外文会议>Electron Devices Meeting, 1995., International
>Very-high fT and fmax silicon bipolartransistors using ultra-high-performance super self-aligned processtechnology for low-energy and ultra-high-speed LSI's
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Very-high fT and fmax silicon bipolartransistors using ultra-high-performance super self-aligned processtechnology for low-energy and ultra-high-speed LSI's
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机译:非常高的f T sub>和f max sub>双极硅超高性能超自对准工艺的晶体管低能耗和超高速LSI的技术
Very-high fT (up to 50 GHz) and fmax (up to70 GHz) silicon bipolar transistors have been developed usingUltra-high-performance Super Self-aligned process Technology (USST).This technology is characterized by drastically-scaled lateraldimensions and shallow, heavily-doped extrinsic base structures. USSTgreatly reduces base-collector junction capacitance and base resistance,and hence makes fmax about twice as large as SST1C technologywithout vertical scaling. The fabricated ECL circuits show a minimumgate delay of 16.5 ps at a switching current of ICS=1.0 mA/G
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机译:f T sub>(高达50 GHz)和f max sub>(高达
70 GHz)硅双极晶体管已使用
超高性能超级自对准工艺技术(USST)。
这项技术的特点是侧向大幅缩放
尺寸和浅的,重掺杂的非本征基础结构。美国科学技术大学
大大降低了基极-集电极结电容和基极电阻,
因此使f max sub>大约是SST1C技术的两倍
没有垂直缩放。制作的ECL电路显示最小
在I CS sub> = 1.0 mA / G的开关电流下的栅极延迟为16.5 ps
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