首页> 外文会议>Emerging Technologies and Factory Automation, 1994. ETFA '94., IEEE Symposium on >New fabrication method and emission characteristics of siliconfield emitters
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New fabrication method and emission characteristics of siliconfield emitters

机译:硅的新制造方法和发射特性场发射器

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摘要

A new fabrication method of silicon field emitters has beenproposed, which combines the Si KOH anisotropic etching andlocal-oxidation of silicon (LOCOS) techniques to form the emitter tip.Wedge-shaped and conical-shaped silicon emitters fabricated using thistechnique had an extremely well-defined structure indicative of goodreproducibility and uniformity of the fabrication process. The emissioncharacteristics have been examined under UHV conditions and it has beenrevealed that both the anode and gate currents are governed by theFowler-Nordheim mechanism and show an excellent emission characteristic
机译:硅场发射器的一种新的制造方法是 提出,结合了Si KOH各向异性蚀刻和 硅的局部氧化(LOCOS)技术形成发射极尖端。 以此制造的楔形和圆锥形硅发射极 技术具有非常明确的结构,表明良好 制造过程的可重复性和均匀性。发射 在特高压条件下已经检查了其特性,并且已经 揭示了阳极和栅极电流都受 Fowler-Nordheim机理并显示出优异的发射特性

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