Real case study of SWEAT EM test on via/line structure as process reliability monitor methodology

摘要

SWEAT (Standard Wafer-level Electromigration Acceleration Test) is one of the various rapid electromigration test techniques proposed for quick monitoring of metal interconnect reliability performance in production line. We have successfully applied the SWEAT test on via/line structure to monitor and screen maverick or defective lots in production. In this work, we present real case studies to illustrate SWEAT test effectiveness as reliability screens and monitor.