首页> 外文会议>Indium Phosphide and Related Materials, 2001. IPRM. IEEE International Conference On >A 60 GHz high power composite channel GaInAs/InP HEMT on InPsubstrate with LG=0.15 μm
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A 60 GHz high power composite channel GaInAs/InP HEMT on InPsubstrate with LG=0.15 μm

机译:InP上的60 GHz高功率复合通道GaInAs / InP HEMTL G = 0.15μm的底物

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We have improved power performance by studying three differentGaInAs/InP composite channel structures. Also, different gate to drainextension devices have been processed. By using composite channeldevices, we benefit from the better ionization threshold energy of InPcompared to GaInAs (1.69 eV against 0.92 eV). The difference ofconduction band offset between the two materials(ΔEC=0.2 eV) makes possible electron transfer fromGaInAs to InP layers with the same electronic properties. New processtechnologies have been applied to compare these structures. The gatecurrent resulting from the impact ionization phenomena is reduced to 30μA at VDS=4.5 V for a large extension device, whichconstitute the best result among the three structures. Also, we improvepower performances at 60 GHz by reducing the GaInAs channel width andsubstituting delta doping by bulk doping. The best device performance is422 mW/mm at VDS=3 V and VGS=0.7 V
机译:通过研究三种不同,我们提高了力量。 GAINAS / INP复合通道结构。另外,不同的门排出 扩展设备已被处理。通过使用复合通道 设备,我们受益于INP的更好的电离阈值能量 与GAINAS(1.69eV反对0.92eV)相比。差异 导通带偏移两种材料 (ΔE c = 0.2ev)可以从 GAINAS到具有相同电子特性的INP层。新进程 已经应用了技术来比较这些结构。大门 受冲击电离现象导致的电流降至30 对于大型扩展设备,V DS = 4.5V的μA 构成三种结构中的最佳结果。此外,我们改进了 通过降低GAINAS通道宽度和60GHz的功率性能 用散装掺杂来替代三角洲掺杂。最好的设备性能是 在V ds = 3v和v gs = 0.7V时,422 MW / mm / mm

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