A new abrasive-free, chemical-mechanical-polishing technique foraluminum metallization of ULSI devices

机译：一种新的无磨料化学机械抛光技术，用于ULSI设备的铝金属化

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A new polishing technique for the aluminum (Al) metallization isdeveloped, referred to as an Abrasive-Free,Chemical-Mechanical-Polishing (AFP) technique, in which aqueous amineand hydrogen-peroxide (H₂O₂) solution is used as apolishing liquid. Scratch-free Al plugs embedded in SiO₂films are obtained by the AFP with the high polishing selectivity of theAl to SiO₂

机译：铝（Al）金属化的一种新抛光技术是开发，称为无磨料，化学机械抛光（AFP）技术，其中胺水溶液过氧化氢（H _{2 O _{2 ）溶液用作
抛光液。嵌入SiO _{2 的无划痕Al塞
通过AFP获得的薄膜具有很高的抛光选择性。
Al到SiO ₂}}}

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《Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International》||p.976-978|共3页
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Hayashi Y.; Kikuta K.; Kikkawa T.;
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A new abrasive-free, chemical-mechanical-polishing technique foraluminum metallization of ULSI devices

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