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Improving Performance, Power, and Area by Optimizing Gear Ratio of Gate-Metal Pitches in Sub-10nm Node CMOS Designs

机译:通过优化低于10nm节点CMOS设计中栅极金属间距的齿轮比来提高性能,功率和面积

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This paper presents improvements in performance, power, and area (PPA) obtained by optimizing the gear ratio (GR) between the Gate and vertical metal layer pitches in standard cells in sub-10nm node CMOS SoC designs. Changing the GR from 1:1 to 3:2 leads to better pin accessibility, routability, and higher cell density. This in turn enables a gate pitch relaxation and associated improvements in cell delay. Implementation of 3:2 GR ultra-dense cells in an SoC CPU block results in up to 17% higher performance, 4% smaller logic size, and 8% lower dynamic power at typical PVT conditions.
机译:本文介绍了通过在Sub-10nm节点CMOS SoC设计中优化栅极和垂直金属层间距之间的齿轮比(GR)而获得的性能,功率和区域(PPA)的改进。从1:1到3:2改变GR导致更好的引脚可访问性,无排水性和更高的细胞密度。这又启用了栅极间距松弛和相关的细胞延迟的相关性。 SOC CPU块中的3:2 GR超致密电池的实现导致性能高达17%,逻辑尺寸为4%,典型PVT条件下的动态功率降低了8%。

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