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Influence of lucky defect distributions on early TDDB failures in SiC power MOSFETs

机译:幸运缺陷分布对SiC功率MOSFET中早期TDDB故障的影响

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In this work, we explore the effect of different defect profiles on the occurrence of early time-dependent-dielectric-breakdown (TDDB) to forecast the defect profile present in commercial grade SiC/SiO2DMOSFETs. Early failure simulations are performed using the recently developed “lucky defect” model. The model shows that the bulk defects in the gate oxide are the likely culprit for early TDDB failures through an increase in tunneling current via trap-assisted-tunneling (TAT). We show that an exponential distribution of “lucky defects” in the oxide bulk affects the failure distribution in a similar fashion to what we observe experimentally. We also identify the implications of under-sampling the population in these extrinsically dominated failure distributions. Armed with these tools, we show that, the speculated carbon rich transition layer at or near the interface is not likely present in the measured DMOSFETs.
机译:在这项工作中,我们探索了不同的缺陷分布对早期随时间变化的介电击穿(TDDB)的影响,以预测商业级SiC / SiO中存在的缺陷分布 2 DMOSFET。早期故障模拟是使用最近开发的“幸运缺陷”模型执行的。该模型表明,通过陷阱辅助隧穿(TAT)导致隧道电流的增加,栅极氧化物中的大量缺陷很可能是导致早期TDDB故障的罪魁祸首。我们表明,氧化物体中“幸运缺陷”的指数分布以与我们实验观察到的相似方式影响失效分布。我们还确定了在这些外部支配的故障分布中总体抽样不足的影响。借助这些工具,我们表明,在测得的DMOSFET中,界面处或界面附近的推测的富碳过渡层不太可能存在。

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