Semiconductor innovation into the next decade

摘要

Semiconductor innovation through a new paradigm of 3D×3D System Scaling can carry the industry into the next decade. Besides the internet of things (IoT), cloud computing, and big data analytics, we can imagine a bionic age emerging with digitally-enhanced or semiconductor-augmented vision, hearing, limbs, and many other capabilities, such as cognitive computing, universal translators, and brain wave interfaces/communications. It is important to leverage the silicon platform and be part of a symbiotic ecosystem, such as TSMC's Grand Alliance and OIP platform, to enjoy the benefits of the economies of scale and collective innovation power.