CMOS digital integrated circuits; UHF integrated circuits; amplitude modulation; ceramics; cryogenic electronics; flip-chip devices; integrated circuit interconnections; interpolation; transmitters; LTCC interposers; PA output balun; amplitude modulation; carrier frequency reconfiguration; core transmitter; digital polar transmitter; efficiency 52 percent; flip-chip interconnection; frequency 0.6 GHz to 2.4 GHz; frequency-reconfigurable multistandard CMOS; low-temperature cofired ceramic interposers; operating frequency bands; phase interpolation; polar transmitter; power amplifier; size 65 nm; universal digital modulator; word length 8 bit; word length 9 bit; CMOS integrated circuits; Frequency modulation; Impedance matching; OFDM; Phase modulation; Power amplifiers; Transmitters; CMOS; LTCC; digital polar modulation; digital transmitter; power amplifier;
机译:一个0.4至4 GHz全数字RF发射机封装,带一个选带插入器,该选通器结合了三个宽带CMOS发射机
机译:HDI插入器上的宽带全数字CMOS RF发射器,具有高功率和效率
机译:紧凑型65nm CMOS发射器IC驱动40Gbps光学系统
机译:具有LTCC插入器的频率可重新配置的多标准65nm CMOS数字变送器
机译:用于RF可重新配置和数字变送器的CMOS集成功率放大器
机译:LTCC插入器上具有倒装CMOS的3轴全集成电容式触觉传感器
机译:一个4通道的多标准自适应串行收发器,范围为1.25-10.3GB / s,CMOS 65nm