Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors

摘要

Fully Integrated Voltage Regulator (FIVR) has been introduced on Intel® Xeon® microprocessors which are switching power converters on die. The FIVR design includes air core inductor structures implemented on the package along with output capacitor, compensators, power transistors and control circuits implemented on-die. FIVR analysis has to comprehend and co-optimize both the package and the die. The power delivery analysis of FIVR is presented and design optimizations are discussed.