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3DTUBE: A Design Framework for High-Variation Carbon Nanotube-based Transistor Technology

机译:3DTube:基于高变碳纳米管的晶体管技术设计框架

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Various emerging technologies have shown great potential of supplementing silicon transistors as Moore's law slows down. One such disruptive technology, carbon nanotube field-effect transistors (CNFETs), is one of the most promising competing technologies available, offering exceptional electrostatic properties. Furthermore, their low-temperature manufacturing process and low power consumption make these devices perfect candidates for 3D integration. However, due to the infancy of their manufacturing process, high defect densities, and variation issues, chip designers are not encouraged to consider these emerging technologies as a stand-alone replacement for Si-based transistors. Hence, to commercialize these new technologies, new architectural and circuit modifications that can work around high-fault rates are required, improving performance comparable to Silicon, while the manufacturing process is perfected.This paper proposes a design flow framework that can be used for large-scale chip production while mitigating yield and variation failures to bring up CNT-based technology, using a reliable reconfigurable architecture. The proposed framework can efficiently support high-variation technologies by providing protection against manufacturing defects at multiple granulari-ties: module and pipeline-stage levels.To incorporate different CNT-based transistor manufacturing processes, this work builds a flexible variation model and a CMOS-based CNT design library that can be used to synthesize physical CNFET-based processor designs over a range of 0.4 to 0.7 V. Based on the variation observed in the synthesized design, a reliable CNT-based 3D multi-granular reconfigurable architecture, 3DTUBE, is presented to overcome the manufacturing difficulties in the technology. For 0.4 V to 0.7 V, 3DTUBE provides up to 6.0× higher throughput and up to 3.1× lower Energy-Delay Product compared to a silicon-based multi-core design evaluated at 1 ppb transistor failure rate, which is 10,000× lower in comparison to CNFETs failure rate.
机译:随着Moore的法律减慢,各种新兴技术表明补充硅晶体管的巨大潜力。一种这种破坏性技术,碳纳米管场效应晶体管(CNFET)是最有前途的竞争技术之一,提供出色的静电性能。此外,它们的低温制造工艺和低功耗使这些设备成为3D集成的完美候选者。但是,由于其制造过程的婴儿,缺陷密度和变异问题,芯片设计人员不鼓励将这些新兴技术视为基于SI的晶体管的独立替代品。因此,为了商业化这些新技术,需要在高故障速率下工作的新技术和电路修改,提高与硅相当的性能,而制造过程是完善的。本文提出了一种设计流框架,可用于大型 - 使用可靠的可重新配置架构,缓解芯片生产,同时减轻产量和变化故障以提高基于CNT的技术。所提出的框架可以通过提供多种粒度的制造缺陷来有效地支持高变化技术:模块和管道级级别。结合不同的基于CNT的晶体管制造工艺,该工作构建了灵活的变化模型和CMOS-基于CNT设计库,可用于在0.4至0.7V的范围内合成物理CNFET的处理器设计。基于合成设计中观察到的变化,一种可靠的基于CNT的3D多粒可重新配置架构,3DTube是提出克服了该技术的制造困难。对于0.4V至0.7V,3DTUBE提供高达6.0倍的吞吐量和高达3.1倍的能量 - 延迟产品,与1 PPB晶体管故障率评估的基于硅的多核设计相比,比较为10,000倍到CNFET失效率。

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