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3DTUBE: A Design Framework for High-Variation Carbon Nanotube-based Transistor Technology

机译:3DTUBE:基于高碳纳米管的晶体管技术的设计框架

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Various emerging technologies have shown great potential of supplementing silicon transistors as Moore's law slows down. One such disruptive technology, carbon nanotube field-effect transistors (CNFETs), is one of the most promising competing technologies available, offering exceptional electrostatic properties. Furthermore, their low-temperature manufacturing process and low power consumption make these devices perfect candidates for 3D integration. However, due to the infancy of their manufacturing process, high defect densities, and variation issues, chip designers are not encouraged to consider these emerging technologies as a stand-alone replacement for Si-based transistors. Hence, to commercialize these new technologies, new architectural and circuit modifications that can work around high-fault rates are required, improving performance comparable to Silicon, while the manufacturing process is perfected.This paper proposes a design flow framework that can be used for large-scale chip production while mitigating yield and variation failures to bring up CNT-based technology, using a reliable reconfigurable architecture. The proposed framework can efficiently support high-variation technologies by providing protection against manufacturing defects at multiple granulari-ties: module and pipeline-stage levels.To incorporate different CNT-based transistor manufacturing processes, this work builds a flexible variation model and a CMOS-based CNT design library that can be used to synthesize physical CNFET-based processor designs over a range of 0.4 to 0.7 V. Based on the variation observed in the synthesized design, a reliable CNT-based 3D multi-granular reconfigurable architecture, 3DTUBE, is presented to overcome the manufacturing difficulties in the technology. For 0.4 V to 0.7 V, 3DTUBE provides up to 6.0× higher throughput and up to 3.1× lower Energy-Delay Product compared to a silicon-based multi-core design evaluated at 1 ppb transistor failure rate, which is 10,000× lower in comparison to CNFETs failure rate.
机译:随着摩尔定律的放慢,各种新兴技术已显示出补充硅晶体管的巨大潜力。碳纳米管场效应晶体管(CNFET)是其中一种破坏性技术,是目前最有前途的竞争技术之一,具有出色的静电性能。此外,它们的低温制造工艺和低功耗使其成为3D集成的理想之选。然而,由于其制造工艺的初期,高缺陷密度和变化问题,不鼓励芯片设计人员将这些新兴技术视为硅基晶体管的独立替代品。因此,要使这些新技术商业化,就需要在高故障率的情况下进行新的架构和电路修改,从而在完善制造工艺的同时提高与硅片相当的性能。本文提出了一种可用于大型制造的设计流程框架。使用可靠的可重新配置架构,在规模化芯片生产的同时减少良率和变异故障,以开发出基于CNT的技术。所提出的框架可通过提供针对多个粒度(模块和流水线阶段)的制造缺陷的保护,从而有效地支持高变技术。为结合不同的基于CNT的晶体管制造工艺,这项工作建立了灵活的变体模型和CMOS-基于CNT的设计库,可用于在0.4至0.7 V的范围内合成基于CNFET的物理处理器设计。基于在合成设计中观察到的变化,可靠的基于CNT的3D多颗粒可重构体系结构3DTUBE提出克服技术中的制造困难。在0.4 V至0.7 V的电压下,与以1 ppb晶体管失效率评估的基于硅的多核设计相比,3DTUBE可提供高达6.0倍的高吞吐量和低至3.1倍的低能耗产品。到CNFET的故障率。

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