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Comparative evaluation of Body Biasing and Voltage Scaling for Low-Power Design on 28nm UTBB FD-SOI Technology

机译:28NM UTBB FD-SOI技术对低功率设计体偏置和电压缩放的比较评价

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摘要

In this paper, we compare the two most common performance tuning techniques: Body-Biasing and Voltage Scaling, when compensating Process, Temperature, and Aging (PTA) variations. We pay special attention to the capability of each technique to improve the worst-case limiting corners that set the product specifications during High Volume Manufacturing (HVM). Results obtained with CAD simulations are validated on silicon with measurements on a 1.4GHz 32-bit ARM? Cortex? with 400kB AXI-memory and ring-oscillator performance monitors fabricated using 28nm FD-SOI technology.
机译:在本文中,我们比较了两种最常见的性能调整技术:在补偿过程,温度和老化(PTA)变化时,体偏置和电压缩放。我们特别注意各种技术的能力,以改善在大容量制造(HVM)期间设置产品规格的最坏情况限制部落。用CAD模拟获得的结果在硅上验证了1.4GHz 32位臂的测量值?皮质?使用28nm FD-SOI技术制造了400KB的Axi-Memory和环形振荡器性能监视器。

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