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A Novel Fault Detection Method for Semiconductor Manufacturing Processes

机译:半导体制造过程的新型故障检测方法

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In this paper, we present a novel fault detection method to address online monitoring problem of semiconductor manufacturing processes. To enhance the fault detection efficiency of existing k-nearest neighbor rule (kNN)-based methods, the principal component analysis (PCA) algorithm is employed to implement data dimension reduction and achieve features of high-dimensional data samples. In addition, to raise the fault detection accuracy for batch processes, the improved kNN algorithm based on the Mahalanobis distance is conducted on features of data samples. The proposed method is evaluated by extensive experiments with industrial examples. The experimental results illustrate great improvements on not only efficiency, but also accuracy. In particular, this method has real potential for monitoring semiconductor manufacturing processes reliably and in time.
机译:在本文中,我们提出了一种新的故障检测方法来解决半导体制造过程的在线监测问题。为了增强现有K-最近邻(KNN)的方法的故障检测效率,采用主成分分析(PCA)算法来实现数据尺寸减小和实现高维数据样本的特征。此外,为了提高批处理的故障检测精度,基于Mahalanobis距离的改进的KNN算法在数据样本的特征上进行。所提出的方法是通过工业实例的广泛实验来评估。实验结果表明了不仅效率的巨大改进,也是精确的。特别地,该方法具有可靠且及时监测半导体制造工艺的实际可能性。

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