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Technology and architecture for deep submicron RF CMOS technology

机译:深亚微米RF CMOS技术的技术和架构

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摘要

RF CMOS is becoming a competitor for the technology of choice for large volume (RFID, WLAN), low and moderate RF frequency range applications (0.9 - 10 GHz). This conclusion would also hold for 65nm node, however it is expected that for the 45nm CMOS devices might differ significantly from 90nm and 65nm bulk CMOS because of the introduction of advanced process modules (like fully silicided gates, metal gates, high-k dielectrics, high mobility layers, ...) and new architecture (fully depleted SOI finfet). From the SOC design point of view, the increased digital device performance might be limited by analog performance limits and supply voltage reduction. In this contribution we present results for 90nm RFCMOS technology including active and passive components and various circuit demonstrator. The importance of passive components is illustrated with a VCO and LNA showing record performances with very low power consumption. The impact of further scaling is also presented to illustrate the trends andthe limits for analog and RF performances.
机译:RF CMOS正成为大批量(RFID,WLAN),中低RF频率范围应用(0.9-10 GHz)的首选技术的竞争者。这一结论在65nm节点上同样适用,但是由于引入了先进的工艺模块(如全硅化栅极,金属栅极,高k电介质,高移动性层……)和新架构(完全耗尽SOI finfet)。从SOC设计的角度来看,提高的数字设备性能可能会受到模拟性能限制和电源电压降低的限制。在这项贡献中,我们介绍了90nm RFCMOS技术的结果,包括有源和无源组件以及各种电路演示器。 VCO和LNA展示了无源组件的重要性,并显示出创纪录的性能以及极低的功耗。还提出了进一步缩放的影响,以说明模拟和RF性能的趋势以及限制。

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