首页> 外文会议>Electrical Performance of Electronic Packaging, 2002 >Finite-thickness conductor models for full-wave analysis of interconnects with the adaptive integral method
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Finite-thickness conductor models for full-wave analysis of interconnects with the adaptive integral method

机译:有限厚度导体模型,用于自适应集成方法的互连全波分析

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摘要

Modeling methodologies are proposed for lossy conductors of finite thickness. The proposed models are such that neither the ease of implementation nor the computational efficiency of a fast adaptive integral equation method-based electromagnetic field solver is penalized.
机译:提出了用于有限厚度的有损导体的建模方法。所提出的模型使得既不易于实现也不基于快速自适应积分方程方法的电磁场求解器的计算效率受到不利影响。

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