A High Reliability, Stress-free Copper Deposit for FPC, Polyimide and Rigid-Flex

摘要

Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular, smooth surfaces, such as polyimide, flex circuit substrates and rigid-flex constructions with window cut-outs, can be a challenge for electroless copper and plating processes. Conventional electroless copper systems often required pre-treatments with hazardous chemicals or have a small process window to achieve a uniform coverage without blistering. To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector of the printed circuit industry.