Evaluation of reliability and production parameters used in newmaterials and processing applications for surface mount technology

摘要

It is pointed out that testing surface-mounted (SM) components forqualification implies a number of carefully selected precautions inorder to be able to draw the right conclusions. The reliability of SMcomponents depends on a whole series of parameters, substrate materialand soldering process being only the most important ones. Therefore, thequalification procedure for SM devices must be designed to incorporatethose aspects. The authors describe such a procedure and deal with theassociated problems. The results of qualification tests on a variety ofSM components are discussed. The experiments show that integratedcircuits in SO and PLCC packages are capable of withstanding theconditions of the SM processes. On the other hand, ceramic capacitors,being very susceptible to cracks, need many precautions to guaranteegood reliability