This paper presents the strategy, methodology and results ofvirtual prototyping-based thermo-mechanical design and qualificationmethods, developed by Philips together with its technology partners. Theresults of virtual thermomechanical prototyping can be used to predict,evaluate and optimise the thermal and mechanical behavior of electronicpackages against the actual packaging requirements prior to majorphysical prototyping and manufacturing investments. The presentedresults show that the development and application of the virtualprototyping method can make substantial contribution to the sustainablebusiness profitability of the electronics industry. The industrialfeasibility and added values of virtual prototyping-basedthermo-mechanical design and qualification methods largely depend on,among other aspects, the advanced methodologies and technologies used tocharacterize and model the process dependent thermomechanical propertiesof packaging materials. Process dependencies are related to theproduction history as well as to the subsequent thermo-mechanicalloading (time, temperature, stress level, geometry, damage evolution,etc.). Therefore, the present paper presents our investigation resultson the state of the art, the bottlenecks and the innovative solutionsfor material characterization and modeling, focusing on solder andpolymer materials and taking into account the needs for futureelectronic packages. The experimental and modeling results presented inthis paper demonstrate that by integrating the proposed innovativesolutions for material characterization and modeling with the virtualthermo-mechanical prototyping methods, competitive packaging developmentcan be achieved
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