Advanced packaging technologies on 3D stacked LSI utilizing themicro interconnections and the layered microthin encapsulation

摘要

The advanced 3D stacking technologies are discussed in this paper.They are the microbumping in 20 μm pitch, the basic processes of theadvanced bonding processes for the high precision and the reliableinterconnections, the novel technologies to encapsulate the layeredmicrothin gaps less than 10 μm, and the non-destructive inspection.These technologies are confirmed to realize the 3D stacked LSIstructure, and it will be expanded to the advanced system packagingtechnologies in the near future