Comparison of multilayer organic and ceramic package simultaneousswitching noise measurements using a 0.16 μm CMOS test chip

摘要

This paper presents a comparison of simultaneous switching-outputnoise measurements taken with a 0.16 μm CMOS test chip on twoflip-chip multilayer packages: IBM's new HyperBGATMhigh-density PTFE-based organic BGA, and an existing IBM ASIC-menualumina-ceramic BGA. In two classes of tests, measured transmitted noisefrom the organic BGA was found to average less than half that of theceramic BGA. Technology and design features of the chip and package testvehicles are described and compared. Several types of simulations,including extracted loop inductance and full-wave simulation of couplingparameters, identify various noise components in each package andelucidate the large differences in measured noise between the twopackages