A new premolded packaging technology for low cost E/O deviceapplications

摘要

This paper describes a new premolded organic packaging technologyfor low cost E/O applications. This premolded packaging technologyprovides a low cost packaging option for E/O devices with highreliability was requirements. A reliability test method for premoldtechnology was used to evaluate water penetration into the packagecavity; it evaluates dew temperature after high temperature and highhumidity storage. Measurement results indicate package performance veryclose to that of a ceramic package. This new low water penetrationorganic material has been developed to supply high reliability, low costpackaging technology to the E/O market. This paper proposes a designconcept utilizing this premold material. The design includes an opticalfiber pipe molded in the side wall of package