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Technology Reinvestment Project's Focus Area: Low Cost Electronic Packaging:Workshop. Held in Denver, Colorado on April 14, 1994

机译:技术再投资项目的重点领域:低成本电子封装:研讨会。 1994年4月14日在科罗拉多州丹佛市举行

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The mission of the Technology Reinvestment Project (TRP) is to stimulate thetransition to a growing, integrated, national industrial capability that provides the most advanced, affordable military systems and the most competitive commercial products. The TRP workshop for the Technology Focus Area titled, 'Low Cost Electronic Packaging,' was held April 14 in Denver, CO. The purpose of this Technology Focus Area will be to develop, demonstrate, and insert low cost packaging technologies which provide a competitive advantage in the application areas such as personal information systems, vehicle engine controls, and hand-held computers.

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