Overview of via formation technologies for ceramic packagingmanufacturing

摘要

Via hole formation plays an important role in multi-layerelectronic packaging fabrication because it provides vertical paths forthe packaging interconnection networks. As the packaging wiring densityand complexity increases, additional and more stringent demands are puton the via formation technology (e.g. tighter dimensional control,higher via positional accuracy, etc.). Over the years, several viaformation technologies have been developed and implemented formanufacturing high performance electronic packages. They range from thetraditional mechanical punch to the state-of-the-art directed energytechnologies such as laser and electron beam. The primary driving forcesfor the various via formation technologies are application extension,performance enhancement, cost reduction, and flexibility. In this paper,an-overview of these via forming technologies along with the comparisonof their capability and flexibility is given. The focus is on mechanicalpunching, laser drilling, and electron beam machining