Rigorous electromagnetic modeling of chip-to-package (first-level)interconnections

摘要

A methodology is presented for the rigorous electromagneticanalysis of pulse transmission through first-level interconnects. Themethodology combines a full-wave, vectorial, time-dependent Maxwell'sequations solver with SPICE circuit models for the nonlinear drivers, tofacilitate the accurate modeling of the electromagnetic phenomenaoccurring at the chip-to-package interface. Comparisons of the resultsobtained using this method with others calculated using SPICEsimulations are used to validate the method and demonstrate itsapplication in the electromagnetic modeling of high-speed packagingstructures