首页> 外文会议>Electronic Components and Technology Conference, 1993. Proceedings., 43rd >Quasi static analysis of hybrid and monolithic integrated circuitsinterconnections
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Quasi static analysis of hybrid and monolithic integrated circuitsinterconnections

机译:混合和单片集成电路的准静态分析相互联系

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Integrated-circuit interconnections are analyzed in quasi-staticmode using the method of lines. The coupling capacitances are determinedfor monolithic and hybrid structures having parallel multiconductors attwo different dielectric layer interfaces. The anisotropy effects on thecoupling between crossing conductors are investigated for differentdimensions of strip width and substrate thickness. The anisotropy effecton the couplings increases with wider strips and thinner substrates. Thecoupling capacitances are also investigated for parallel conductors onan isotropic substrate. For parallel coplanar conductors the couplingsincrease with closer strips and thicker substrates, while for conductorson different interfaces the coupling capacitance increases for widerstrips and thinner substrates. The number of strips affects thecouplings for thicker dielectric substrates
机译:准静态分析集成电路互连 模式使用线的方法。确定耦合电容 用于具有并联多导体的单片和混合结构 两个不同的介电层界面。各向异性对 研究不同导体之间的交叉耦合 条带宽度和基材厚度的尺寸。各向异性效应 带越宽,带材越薄,联轴器上的孔数就越多。这 还研究了并联电容器上的耦合电容 各向同性的基板。对于平行共面导体,联轴器 靠近条带和较厚的基板时,导电率会增加,而对于导体而言, 在不同的接口上,耦合电容增加,范围更广 条和较薄的基材。条带的数量会影响 较厚介电基板的联轴器

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