A Land Grid Array (LGA) package was designed and fabricated toutilize specific materials and design concepts for high speed operation.The performance of this LGA was compared with that of a functionally anddimensionally equivalent Pin Grid Array (PGA) that is currently beingused to package high speed silicon ECL gate arrays. Two structures thatwere sources of signal degradation in the PGA, the pins and a layer ofplating lines, were eliminated in the design of the LGA. The package wasfabricated out of DuPont Green Tape low temperature co-fired ceramic(LTCC) with gold conductors and vias. This combination of an improvedLGA structure and materials with superior high speed properties resultedin a package with improved performance and decreased signal degradationwhen compared with conventional high temperature co-fired ceramic (HTCC)PGAs. The LGA has a heatsink made from a new Metal Matrix Composite(MMC) of Al in a sintered silicon carbide matrix
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