Multichip module technologies, a win-win strategy based ontechnology leverage and convergence for IC supplies and workstationcustomers

摘要

Trends in packaging technologies are reviewed. It is suggestedthat advanced packaging solutions such as multichip modules (MCMs) willmake possible future high-performance workstations. High I/O count,signal frequency, integrity, and power and low cost will drive thepackaging solutions for WS. Single-chip packages will become better andmay postpone use of bare chip MCMs: bare chip MCMs will be essential fortop performance. Cu/PI-type substrates are still too expensive; AlN,glass ceramic, and advanced printed circuit boards will be attractiveoptions; multilevel thick-film finelines can bridge the substrateinterconnect cost/performance gap