Micro carrier for LSI chip used in the Hitachi M-800 processorgroup

摘要

A compact chip carrier called the MCC (micro carrier for LSI chip)has been developed for high-density chip level packaging. The MCCrealizes the smallest possible hermetic chip package by introducing fullsurface flip-chip interconnections, thin-film process technology,built-in termination resistors, and thermal expansion matched ceramicsubstrate. The MCCs are based on the mullite ceramic substrate andAl-polyimide thin-film circuits with built-in thin-film terminationresistors. The main role of the MCC is to reliably interconnect the LSII/Os and MLC I/Os by matching the I/O pad pitches of the LSI and thoseof the MLC. The authors discuss the structure of the MCC and thethin-film process technology for its fabrication