Micro carrier for LSI chip used in the Hitachi M-800 processor group

摘要

A compact chip carrier called the MCC (micro carrier for LSI chip) has been developed for high-density chip level packaging. The MCC realizes the smallest possible hermetic chip package by introducing full surface flip-chip interconnections, thin-film process technology, built-in termination resistors, and thermal expansion matched ceramic substrate. The MCCs are based on the mullite ceramic substrate and Al-polyimide thin-film circuits with built-in thin-film termination resistors. The main role of the MCC is to reliably interconnect the LSI I/Os and MLC I/Os by matching the I/O pad pitches of the LSI and those of the MLC. The authors discuss the structure of the MCC and the thin-film process technology for its fabrication.