Evaluation and characterization of high-performance fillingencapsulants for system chips application

摘要

An innovative Precisely Interconnected Chips (PIC) technology iscurrently under development at IBM to seek more effective means ofcreating system chips. This development focuses on developingfabrication methods to permit the realization of high yielding largearea chips, as well as chips that may contain very diverse technologies.Another focus is to realize system chips which have their basic chipcharacteristics compromised as is the case in many of today's systemchip concepts. This paper reports on the use of a high performancefilling encapsulant based on epoxy resin, which is used to connect thedifferent chip sector macros that make up the system chip. This novelencapsulant remains thermally stable through the subsequent processingtemperature hierarchies during the system chips fabrication. SphericalSiO₂ powders (with special morphology and size distribution)are incorporated into the epoxy resin to improve its mechanicalproperties, reduce coefficient of thermal expansion, and increasethermal conductivity. Adhesion and rheological properties of theformulated materials are evaluated. Microstructure of the filled Epoxysystem is investigated to confirm the thermal reliability of theencapsulants. The formulated EPOXY A resin is qualified formanufacturing process based on the filling process, mechanicalintegrity, and thermal reliability