An innovative flexible and accurate packaging technique suited tofabricate low cost micro optoelectronic modules

摘要

Several groups are presently investigating the opportunity tofabricate miniaturized optical devices characterized by high attachmentprecision. An automated surface mounted technique based on standardizedsupports of 10×10×4 mm3 size and on activein-situ alignment of the optical elements had been developed in ourlaboratories. This surface mounted device (SMD) technique is well suitedfor a flexible production of small optical devices and it allows a twodimensional layout. It is limited in precision to ±1 μm and itis not adapted for further miniaturization. It is briefly described inthis paper. Here, we mainly report on a new automated and low costoptical-SMD packaging technique, named “Three DimensionalMiniaturized Optical Surface Mounted Device (TRIMO-SMD)”, based ona in-situ active alignment of standardized 2.5×3.5×1mm3 elements by a laser soldering reflow process. A submicron alignment precision is achieved and a attachment strength of -20N is guaranteed. The technique offers the potential of 3 dimensionallayouts and integration on the same layout of electronic and opticalelements