Flip chip processing of lead-free solders and halogen-free highdensity microvia substrates

摘要

Over the past several years, flip chip technology has been heavilyfocused on developing and refining the next generation of flip chipassembly and reliability; yet, little attention has been paid to theenvironmentally conscious aspects of manufacturing and high processthroughput. With legislation pending on the use of lead in Europe andJapan and to limit environmental impact, flip chip technology mustaddress new ways to meet safety and environmental requirements for thematerials and processes used during assembly. The focus of this work isto implement advanced lead-free solder interconnect technology andhalogen-free high density microvia substrates and define a systems-levellow-cost flip chip material and process technology minimizingenvironmental impact. The ultimate objective is to ensure thatenvironmentally friendly materials are selected, along with acceptableprocess technology for all materials as well as for the flip chipassembly