LOC tape design for protecting integrated circuit pattern fromdamage due to a dicing saw blade

摘要

In general, the scribing position of a dicing saw blade is closeto the IC (integrated circuit) device because the mounting density ofthe separated IC device (i.e. productibility or yield) increases by thereduced dimension of the scribe regions. So, the IC patterns are notfree from mechanical damage due to the dicing saw blade. In the presentstudy, in order to protect the IC patterns from the impact due to thedicing saw blade, the pattern layers on the scribe regions of asemiconductor wafer are selectively removed and so, the bare siliconsurface is exposed therein. The scribe regions (where the layers areabsent) are then replaced by polyimide prior to the wafer dicingprocess. Since the polyimide film has a considerably larger adhesionstrength with the silicon surface, compared with other pattern layers orplastic-encapsulants, it effectively absorbs the force of the impact ofthe saw blade