Lens-less semiconductor optical amplifier (SOA) modules using laserwelding techniques

摘要

We report the high performance SOA modules made using laserwelding technique. The SOA chip is DH structure and its stripe of activelayer is tilted by 7° and facet is AR coated for low reflection of10-5 order. We used a cylindrical type laser welding (it is3-point welding) for fiber fixing the fiber for direct coupling. We usedspecially designed the components of ferrule, sleeve, and submodule. Thelap welding is used in the ferrule-sleeve fixing and lap-fillet weldingin sleeve-submodule the fixing is used. The welding loss is usually lessthan 0.5 dB after a readjustment. This method is proven to be a verysimple and stable technique for direct coupling. The chip gain and farfield angle are 30 dB and 160×160 respectively, and the fiber istaper lensed fiber. With the coupling loss and the welding loss of -2.2dB/facet, we can obtain the module gain of 25 dB