首页> 外文会议>Electrical Electronics Insulation Conference and Electrical Manufacturing Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition >Recent progress in computer simulation applied in the automaticpressure gelation (APG) process for epoxy casting systems
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Recent progress in computer simulation applied in the automaticpressure gelation (APG) process for epoxy casting systems

机译:自动计算机中计算机仿真的最新进展环氧浇铸系统的压力凝胶化(APG)工艺

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The authors present fundamental information about the first stepsof modeling the nonlinear gelation and curing phenomena of an epoxyresin system based on available material data with respect to therelevant chemical reactions and energy balance. The necessaryassumptions concerning the filling of the tool, the heat transfer andshrinking of the material are discussed. In the case of simple shapedparts, such as plates, rods and post insulators, the results of computersimulations are available and are visualized. The propagation of thegelation and curing zone, including the time dependent temperaturedistribution, can be displayed on the screen. Comparison betweencalculated and measured data from moulding experiments is in fairly goodagreement
机译:作者介绍了有关第一步的基本信息 环氧树脂的非线性胶凝和固化现象的建模 基于可用材料数据的树脂系统 相关的化学反应和能量平衡。必要 有关工具填充,传热和 讨论材料的收缩。在简单的情况下 零件,例如板,杆和支柱绝缘子,计算机的结果 模拟可用并且可视化。传播 胶凝和固化区,包括随时间变化的温度 分布,可以显示在屏幕上。之间的比较 成型实验的计算和测量数据相当不错 协议

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