A new Embedded Packaging Technology for high power LEDs

摘要

A new wafer level packaging concept for a multi-color Light Emitting Diode (LED) lighting device is suggested and demonstrated. The concept tackles 2 major challenges in high power LED packaging: optical out-coupling and high operating temperatures. The standard way of forming an optical package is based on assembling LEDs onto a substrate and subsequently mounting an optical body (e.g., a lens) onto the LEDs afterwards. The method proposed here is a reverse order method, meaning, first mounting the LEDs inside an optical body and next forming the electrical connections. The use of high temperature resistive materials holds the promise of using the device at high operating temperatures and the embedded optical coupling maximizes the light emission efficiency of these devices.