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Data acquisition sensitivity determination of a sensor-on-a-chip integrated microsystem

机译:片上传感器集成微系统的数据采集灵敏度确定

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A sensor-on-a-chip integrated microsystem was implemented through standard silicon (Si) complementary metal oxide semiconductor (CMOS) fabrication and optical waveguide integration processes. The fabricated Si CMOS chip has embedded lateral pnp bipolar junction transistor (BJT) photodetector arrays and low-noise analog front-ends for signal conditioning and photodetector support. An array of parallel mixed-signal oversampled noise-shaping analog-to-digital converter (ADC) circuits was implemented as a sensor readout system. Mach Zehnder interferometric optical waveguides were post-processed on the fabricated chip surface. The electrical and optical sensitivity of the sensor Si CMOS integrated circuit signal processing components is reported, and optical sensitivity of 100 pW is inferred from measured data.
机译:通过标准硅(Si)互补金属氧化物半导体(CMOS)制造和光波导集成工艺实现了片上传感器集成微系统。所制造的Si CMOS芯片具有嵌入式横向pnp双极结晶体管(BJT)光电探测器阵列以及用于信号调节和光电探测器支持的低噪声模拟前端。实现了一组并行混合信号过采样噪声整形模数转换器(ADC)电路,作为传感器读出系统。 Mach Zehnder干涉式光波导在制成的芯片表面上进行了后处理。报告了传感器Si CMOS集成电路信号处理组件的电气和光学灵敏度,并从测量数据推断出100 pW的光学灵敏度。

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