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Data acquisition sensitivity determination of a sensor-on-a-chip integrated microsystem

机译:数据采集​​灵敏度确定传感器芯片集成显微系统

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A sensor-on-a-chip integrated microsystem was implemented through standard silicon (Si) complementary metal oxide semiconductor (CMOS) fabrication and optical waveguide integration processes. The fabricated Si CMOS chip has embedded lateral pnp bipolar junction transistor (BJT) photodetector arrays and low-noise analog front-ends for signal conditioning and photodetector support. An array of parallel mixed-signal oversampled noise-shaping analog-to-digital converter (ADC) circuits was implemented as a sensor readout system. Mach Zehnder interferometric optical waveguides were post-processed on the fabricated chip surface. The electrical and optical sensitivity of the sensor Si CMOS integrated circuit signal processing components is reported, and optical sensitivity of 100 pW is inferred from measured data.
机译:通过标准硅(Si)互补金属氧化物半导体(CMOS)制造和光波导集成工艺来实现芯片芯片的集成微系统。制造的SI CMOS芯片具有嵌入式横向PNP双极连接晶体管(BJT)光电探测器阵列和用于信号调节和光电探测器支撑的低噪声模拟前端。并行混合信号过样的噪声整形模数转换器(ADC)电路阵列作为传感器读出系统实现。 Mach Zehnder干涉光学波导在制造的芯片表面上后处理。报告了传感器SI CMOS集成电路信号处理组件的电气和光学灵敏度,并从测量数据推断出100pW的光学灵敏度。

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