A new failure analysis approach to predict and localize defects and weakness areas in trough-glass-vias for a multifunctional package level camera

摘要

In this paper, we provide a novel approach to identify failures and defects that occur in the glass interposer of a system-on-package technology-based miniaturized multifunctional camera. First, we use simulations to validate the proposed defect prediction and/or weakness identification techniques. Then, we confirm the predictions using non-destructive failure analysis techniques. Finally, we use the physical analysis techniques to confirm the software failure mode assumptions.