An unique method to fabricate on-chip capacitors for chip-level EMC evaluation

摘要

In this work, we proposed an unique method to fabricate on-chip capacitors connected to IC inner circuits by the application of focused ion beam (FIB) techniques. It is a convenient and cost-saving way to verify the chip-level electromagnetic compatibility (EMC) performance. The effect of the FIB-fabricated on-chip decoupling capacitor on improving electromagnetic interference (EMI) performance was also shown in the present study, based on the results of the transverse electromagnetic transmission (TEM) cell and surface scan measurements.