Cooling mechanism for high performance device analysis

摘要

Performing optical failure analysis on high power consumption devices (e.gs. gaming GPUs, server chips) traditionally has many limitations. Some failures occur only at full speed meaning both high resolution imaging and active cooling must take place at the same time. Diamond cooling windows have high heat dissipation [1], but may require complete physical contact with all device hot spots during test to avoid thermal runaway. Water cooling solutions can overcome the physical contact problem, but present the issue of needing to protect lenses and turrets from the water coolant. Water containment solutions can place limitations on the number of lenses and magnifications available for imaging. This paper describes a novel, highly contained water cooling solution that has achieved 200 watt DUT power dissipation while allowing for both SIL and flexible 10-lens turret imaging.